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Machine de marquage au laser UV
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The 3W UV Laser Marking Machine utilizes advanced 355nm laser technology, specifically designed for high-precision, high-quality marking requirements. This equipment demonstrates exceptional performance on various materials including glass, electronic components, ceramics, and polymers, making it an ideal choice for precision processing applications.
Ultra-fine marking: Minimum line width 0.03mm, positioning accuracy 0.01mm
Wide material compatibility: Perfect for processing glass, wafers, ceramics, textiles, etc.
High efficiency: Marking speed up to 12000mm/s
User-friendly operation: 10-inch touch screen, intuitive and simple
Robust construction: All-aluminum structure ensures long-term stable operation
The cold processing characteristics of UV laser prevent material thermal damage, ensuring clear and permanent markings. The equipment supports multiple marking area options, up to 110×110mm maximum, meeting various production requirements. The compact 70kg design (656×568×1365mm) suits diverse production environments.
Electronics industry: TFT, LCD screens, IC chip marking
Glass products: Decorative glass, instrument scale marking
Semiconductor: Monocrystalline silicon wafers, sapphire substrate processing
Textile industry: Polymer films, synthetic material marking
Ceramic industry: Thin ceramic sheet precision engraving
| Laser Power | 3W |
|---|---|
| Laser Wavelength | 355nm |
| Operation Interface | 10-inch touch screen |
| Minimum Line Width | 0.03mm |
| Positioning Accuracy | 0.01mm |
| Marking Speed | ≤12000mm/s |
| Marking Area | ≤110×110mm (multiple options available) |
| Machine Weight | 70kg |
| Overall Dimensions | 656×568×1365mm |
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Includes FAQ section addressing common distributor inquiries
Technical parameters presented in table format for easy comparison
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Suitable for global markets including Southeast Asia, Americas, Middle East, and Africa
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